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US Patent Issued to Intel on Aug. 4 for "Micro light emitting diode structures for efficient communication of an optical signal" (California, Arizona Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,068, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Micro light emitting diode structures for efficient communication... Read More


US Patent Issued to Micron Technology on Aug. 4 for "Composite dielectric structures for semiconductor die assemblies and associated systems and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,069, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Composite dielectric structures for semiconductor die assembl... Read More


US Patent Issued to Alps Alpine on Aug. 4 for "Display device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,070, issued on Aug. 4, was assigned to Alps Alpine Co. Ltd. (Japan). "Display device" was invented by Seiki Sugisawa (Miyagi-ken, Japan), Na... Read More


US Patent Issued to TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) on Aug. 4 for "Display panel and display device" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,071, issued on Aug. 4, was assigned to TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) Co. LTD. (Xiamen, China). "Display panel and di... Read More


US Patent Issued to VueReal on Aug. 4 for "Self-aligned vertical solid state devices fabrication and integration methods" (Canadian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,072, issued on Aug. 4, was assigned to VueReal Inc. (Waterloo, Canada). "Self-aligned vertical solid state devices fabrication and integrati... Read More


US Patent Issued to Applied Materials on Aug. 4 for "Power architecture with dual core advance substrate" (American, Indian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,073, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Power architecture with dual core advance substrate" w... Read More


US Patent Issued to Xiamen PVTECH on Aug. 4 for "Light-emitting diode light source having high luminous efficiency" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,074, issued on Aug. 4, was assigned to Xiamen PVTECH Co. Ltd. (Xiamen, China). "Light-emitting diode light source having high luminous effic... Read More


US Patent Issued to BARCO on Aug. 4 for "Light emitting modules with optical data transmission" (Belgian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,075, issued on Aug. 4, was assigned to BARCO N.V. (Kortrijk, Belgium). "Light emitting modules with optical data transmission" was invented ... Read More


US Patent Issued to BOE MLED Technology, BOE TECHNOLOGY GROUP on Aug. 4 for "Display module assembly member, display module and splicing display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,076, issued on Aug. 4, was assigned to BOE MLED Technology Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display module a... Read More


US Patent Issued to Deca Technologies USA on Aug. 4 for "Method of making a fan-out semiconductor assembly with an intermediate carrier" (Arizona, California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,077, issued on Aug. 4, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.). "Method of making a fan-out semiconductor assembly with an... Read More